Tvs Diode Array Spa Diodes Page 85 TVS Diode Array SPA Diodes Catalog

2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA Diodes) General Purpose ESD Protection - SP1007 Series Pulse Waveform Capacitance vs. Reverse Bias 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Bias Voltage (V) Capacitance (pF) 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 SP1007-01ETG SP1007-01WTG 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time ( s) Percent of I PP Insertion Loss (S21) I/O to GND Frequency (MHz) Attenuation (dB) -35 -30 -25 -20 -15 -10 -5 0 -40 -45 10 100 1000 Time Temperature T P T L T S(max) T S(min) 25 t P t L t S time to peak temperature Preheat Ramp-up Ramp-down Ramp-do Critical Zone TL to T P Critical Zone TL to T P Reflow Condition Pb - Free assembly Pre Heat - Temperature Min (T s(min) ) 150C - Temperature Max (T s(max) ) 200C - Time (min to max) (t s ) 60 - 180 secs Average ramp up rate (Liquidus) Temp (T L ) to peak 3C/second max T S(max) to T L - Ramp-up Rate 3C/second max Reflow - Temperature (T L ) (Liquidus) 217C - Temperature (t L ) 60 - 150 seconds Peak Temperature (T P ) 260 +0/-5 C Time within 5C of actual peak Temperature (t p ) 20 - 40 seconds Ramp-down Rate 6C/second max Time 25C to peak Temperature (T P ) 8 minutes Max. Do not exceed 260C Soldering Parameters Product Characteristics of SOD-882 Package Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13.

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