Tvs Diode Array Spa Diodes Page 55 TVS Diode Array SPA Diodes Catalog

2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA Diodes) General Purpose ESD Protection - SP1001 Series Absolute Maximum Ratings Symbol Parameter Value Units I PP Peak Current (t p =8/20 s) 2 A T OP Operating Temperature -40 to 125C T STOR Storage Temperature -55 to 150C CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (T OP = 25C) Parameter Symbol Test Conditions Min Typ Max Units Forward Voltage Drop V F I F =10mA 0.7 0.9 1.2 V Reverse Voltage Drop V R I R =1mA 6.0 8.5 V Reverse Standoff Voltage V RWM I R 1A 5.5 V Reverse Leakage Current I LEAK V R =5V 0.1 A Clamp Voltage 1 V C I PP =1A, t p =8/20s, Fwd 8.0 11.0 V I PP =2A, t p =8/20s, Fwd 9.7 13.0 V Dynamic Resistance R DYN (V C2 - V C1 ) / (I PP2 - I PP1 ) 1.7 ESD Withstand Voltage 1,2 V ESD IEC61000-4-2 (Contact) 15 kV IEC61000-4-2 (Air) 30 kV Diode Capacitance 1 C D Reverse Bias=0V 12 pF Reverse Bias=2.5V 8 pF Reverse Bias=5V 7 pF Notes: 1 Parameter is guaranteed by device characterization 2 A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode Thermal Information Parameter Rating Units Storage Temperature Range -55 to 150C Maximum Junction Temperature 150C Maximum Lead Temperature (Soldering 20s-40s) 260C Capacitance vs. Reverse Bias 0 2 4 6 8 10 12 14 DC Bias (V) Capacitance (pF) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 Design Consideration Because of the fast rise-time of the ESD transient, placement of ESD devices is a key design consideration. To achieve optimal ESD suppression, the devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install the ESD suppressors directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. They are connected from signal/data line to ground.

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