Tvs Diode Array Spa Diodes Page 43 TVS Diode Array SPA Diodes Catalog

2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA Diodes) General Purpose ESD Protection - SP725 Series Package Dimensions - Small Outline Plastic Packages (SOIC) Time Temperature T P T L T S(max) T S(min) 25 t P t L t S time to peak temperature Preheat Ramp-up Ramp-down Ramp-do Critical Zone TL to T P Critical Zone TL to T P Reflow Condition Pb - Free assembly Pre Heat - Temperature Min (T s(min) ) 150C - Temperature Max (T s(max) ) 200C - Time (min to max) (t s ) 60 - 180 secs Average ramp up rate (Liquidus) Temp (T L ) to peak 5C/second max T S(max) to T L - Ramp-up Rate 5C/second max Reflow - Temperature (T L ) (Liquidus) 217C - Temperature (t L ) 60 - 150 seconds Peak Temperature (T P ) 260 +0/-5 C Time within 5C of actual peak Temperature (t p ) 20 - 40 seconds Ramp-down Rate 5C/second max Time 25C to peak Temperature (T P ) 8 minutes Max. Do not exceed 260C Soldering Parameters INDEX AREA E D N 1 2 3 -B- 0.25(0.010) C A M B S e -A- L B M -C- A1 A SEATING PLANE 0.10(0.004) h x 45 o C H 0.25(0.010) B M M Notes: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L " is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B" , as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. Package SOIC Pins 8 JEDEC MS-012 Millimeters Inches Notes Min Max Min Max A 1.35 1.75 0.0532 0.0688 - A1 0.10 0.25 0.0040 0.0098 - B 0.33 0.51 0.013 0.020 9 C 0.19 0.25 0.0075 0.0098 - D 4.80 5.00 0.1890 0.1968 3 E 3.80 4.00 0.1497 0.1574 4 e 1.27 BSC 0.050 BSC - H 5.80 6.20 0.2284 0.2440 - h 0.25 0.50 0.0099 0.0196 5 L 0.40 1.27 0.016 0.050 6 N 8 7 0 o 8 o 0 o 8 o -

Previous Page
Next Page