Tvs Diode Array Spa Diodes Page 127 TVS Diode Array SPA Diodes Catalog

2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA Diodes) Low Capacitance ESD Protection - SP3004 Series Capacitance vs. Frequency 0 2E-13 4E-13 6E-13 8E-13 1E-12 1.2E-12 1.4E-12 1.6E-12 1.8E-12 2E-12 1.E+06 1.E+07 1.E+08 1.E+09 Frequency [Hz] Capacitance [F] Product Characteristics Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Time Temperature T P T L T S(max) T S(min) 25 t P t L t S time to peak temperature Preheat Ramp-up Ramp-down Ramp-do Critical Zone TL to T P Critical Zone TL to T P Reflow Condition Pb - Free assembly Pre Heat - Temperature Min (T s(min) ) 150C - Temperature Max (T s(max) ) 200C - Time (min to max) (t s ) 60 - 180 secs Average ramp up rate (Liquidus) Temp (T L ) to peak 3C/second max T S(max) to T L - Ramp-up Rate 3C/second max Reflow - Temperature (T L ) (Liquidus) 217C - Temperature (t L ) 60 - 150 seconds Peak Temperature (T P ) 260 +0/-5 C Time within 5C of actual peak Temperature (t p ) 20 - 40 seconds Ramp-down Rate 6C/second max Time 25C to peak Temperature (T P ) 8 minutes Max. Do not exceed 260C Soldering Parameters Leakage Current vs Temperature I /O to GND Leakage (pA) Temperature ( C) 0 25 45 65 1 10 100 1000 5V Bias 3.3V Bias

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