Thyristor Semiconductor Products Page 9 Thyristor

2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/14/14 Teccor brand Thyristors Only those products which pass tests designed to assure Littelfuse's high quality and reliability standards, while economically satisfying customer requirements, are approved for shipment. All new products and materials must receive approval of QRA prior to being released to production. The combination of reliability testing, process controls, and lot tracking assures the quality and reliability of Littelfuse's devices. Since even the best control systems cannot overcome measurement limitations, Littelfuse designs and manufactures its own computerized test equipment. Littelfuse's Reliability Engineering Group conducts ongoing product reliability testing to further confirm the design and manufacturing parameters. Reliability Stress Tests The following table contains brief descriptions of the reliability tests commonly used in evaluating Littelfuse product reliability on a periodic basis. These tests are applied across product lines depending on product availability and test equipment capacities. Other tests may be performed when appropriate. Test Type Typical Conditions Test Description Standards High Temperature AC Blocking Rated V DRM (VAC-peak), 110C up to 125C, 1008 hours Evaluation of the reliability of product under bias conditions and elevated temperature MIL-STD-750 (Method 1040) High Temperature Storage Life 150C, 1008 hours Evaluation of the effects on devices after long periods of storage at high temperature MIL-STD-750 (Method 1031) Biased Temperature & Humidity 160V DC 1008 hours Evaluation of the reliability of non-hermetic packaged devic- es in humid environments EIA/JEDEC, JESD22-A101 Temperature Cycle [Air to Air] -65C to 150C, 15-minute dwell, 10 up to 500 cycles Evaluation of the device's abil- ity to withstand the exposure to extreme temperatures and the forces of TCE during transi- tions between temperatures MIL-STD-750 (Method 1051), EIA/JEDEC, JESD22-A104 Thermal Shock [Liquid to Liquid] 0C to 100C, 5-minute dwell, 10-second transfer, 10 cycles Evaluation of the device's abil- ity to withstand the sudden changes in temperature and exposure to extreme tempera- tures MIL-STD-750 (Method 1056) Autoclave (PCT) 168 hours Accelerated environmental test to evaluate the moisture resistance of plastic packages EIA/JEDEC, JESD22-A102 Resistance to Solder Heat 260C, 10 seconds Evaluation of the device's abil- ity to withstand the tempera- tures as seen in wave solder- ing operations MIL-STD-750 (Method 2031) Solderability Steam Aging (1 to 8 hrs) 245C Solder Temperature Evaluation of the solderability of device terminals after simu- lated aging ANSI J-STD-002 Lead Bend Evaluation of resistance of device leads to metal fatigue MIL-STD-750 (Method 2036) Moisture Sensitivity Level 3 reflow cycles (260C peak) Evaluation to determine device immunity to moisture JEDEC J-STD-020 Level 1 ESD HBM, 8kV CDM, 15kV Evaluation to determine device immunity to electro-static dis- charge JESD22-A114, MIL-STD-883D 3015.7, JESD22-C101 Flammability Test For the UL 94V0 flammability test, all epoxies used in Littelfuse encapsulated devices are recognized by Underwriters Laboratories. Quality and Reliability Assurance (continued)

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