Thyristor Semiconductor Products Page 170 Thyristor

2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/14/14 Teccor brand Thyristors 10 Amp Standard & Alternistor (High Communitation) Triacs Soldering Parameters Reflow Condition Pb - Free assembly Pre Heat - Temperature Min (T s(min) ) 150C - Temperature Max (T s(max) ) 200C - Time (min to max) (t s ) 60 - 180 secs Average ramp up rate (Liquidus Temp) (T L ) to peak 5C/second max T S(max) to T L - Ramp-up Rate 5C/second max Reflow - Temperature (T L ) (Liquidus) 217C - Temperature (t L ) 60 - 150 seconds Peak Temperature (T P ) 260 +0/-5 C Time within 5C of actual peak Temperature (t p ) 20 - 40 seconds Ramp-down Rate 5C/second max Time 25C to peak Temperature (T P ) 8 minutes Max. Do not exceed 280C Physical Specifications Environmental Specifications Test Specifications and Conditions AC Blocking MIL-STD-750, M-1040, Cond A Applied Peak AC voltage @ 125C for 1008 hours Temperature Cycling MIL-STD-750, M-1051, 100 cycles; -40C to +150C, 15-min dwell-time Temperature/ Humidity EIA/JEDEC, JESD22-A101 1008 hours; 320V - DC: 85C; 85% rel humidity High Temp Storage MIL-STD-750, M-1031, 1008 hours; 150C Low-Temp Storage 1008 hours; -40C Thermal Shock MIL-STD-750, M-1056 10 cycles; 0C to 100C; 5-min dwell time at each temperature; 10 sec (max) transfer time between temperature Autoclave EIA/JEDEC, JESD22-A102 168 hours Resistance to Solder Heat MIL-STD-750 Method 2031 Solderability ANSI/J-STD-002, category 3 Test A Lead Bend MIL-STD-750, M-2036 Cond E Terminal Finish 100% Matte Tin-plated Body Material UL recognized epoxy meeting flammabilty classification 94V-0. Terminal Material Copper Alloy Design Considerations Careful selection of the correct device for the application's operating parameters and environment will go a long way toward extending the operating life of the Thyristor. Good design practice should limit the maximum continuous current through the main terminals to 75% of the device rating. Other ways to ensure long life for a power discrete semiconductor are proper heat sinking and selection of voltage ratings for worst case conditions. Overheating, overvoltage (including dv/dt), and surge currents are the main killers of semiconductors. Correct mounting, soldering, and forming of the leads also help protect against component damage. Time Temperature T P T L T S(max) T S(min) 25 t P t L t S time to peak temperature Preheat Ramp-up Ramp-down Ramp-do

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