Resettable Ptc Products Page 68 Resettable PTC Products

POLY-FUSE Resettable PTCs 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/22/17 Radial Leaded > USBR Series Environmental Specifications Operating/Storage Temperature -40C to +85C Maximum Device Surface Temperature in Tripped State 125C Passive Aging +85C, 1000 hours -/+5% typical resistance change Humidity Aging +85C, 85% R.H., 1000 hours -/+5% typical resistance change Thermal Shock +85C to -40C 10 times -/+5% typical resistance change Solvent Resistance MIL-STD-202, Method 215 Moisture Sensivitivy Level Level 1, J-STD-020 Physical Specifications Lead Material .90-2.50A: Tin-plated Copper clad steel .75A: Tin-plated Copper Soldering Characteristics Solderability per MIL-STD-202, Method 208 Insulating Material Cured, flame retardant epoxy polymer meets UL 94V-0 requirements. Device Labeling Marked with 'LF', voltage, current rating, and date code. Part Number Figure A B C D E Physical Characteristics Inches mm Inches mm Inches mm Inches mm Inches mm Lead (dia) Material Max. Max. Max. Max. Typ. Typ. Min. Min. Max. Max. Inches mm 06R075B 1 0.27 6.9 0.45 11.4 0.20 5.1 0.30 7.6 0.12 3 0.020 0.51 Sn/Cu 06R120B 1 0.27 6.9 0.46 11.7 0.20 5.1 0.30 7.6 0.12 3 0.020 0.51 Sn/CuFe 06R155B 1 0.27 6.9 0.46 11.7 0.20 5.1 0.30 7.6 0.12 3 0.020 0.51 Sn/CuFe 16R090B 2 0.29 7.4 0.48 12.2 0.20 5.1 0.30 7.6 0.12 3 0.020 0.51 Sn/CuFe 16R110B 2 0.29 7.4 0.56 14.2 0.20 5.1 0.30 7.6 0.12 3 0.020 0.51 Sn/CuFe 16R135B 2 0.35 8.9 0.53 13.5 0.20 5.1 0.30 7.6 0.12 3 0.020 0.51 Sn/CuFe 16R160B 2 0.35 8.9 0.60 15.2 0.20 5.1 0.30 7.6 0.12 3 0.020 0.51 Sn/CuFe 16R185B 2 0.40 10.2 0.62 15.7 0.20 5.1 0.30 7.6 0.12 3 0.020 0.51 Sn/CuFe 16R250B 2 0.45 11.4 0.72 18.3 0.20 5.1 0.30 7.6 0.12 3 0.020 0.51 Sn/CuFe Dimensions (mm) Figure 2 A E B C D A C B D E Figure 1 Soldering Parameters Preheating 160 190 220 260 0 5 max. Temperature (C) Soldering Cooling 60 min. Time(s) Pre-Heating Zone Refer to the condition recommended by the flux manufacturer. Max. ramping rate should not exceed 4C/ Sec. Soldering Zone Max. solder temperature should not exceed 260C Time within 5C of actual Max. solder temperature within 3 - 5 seconds Total time from 25C room to Max. solder temperature within 5 minutes including Pre-Heating time Cooling Zone Cooling by natural convection in air. Max. ramping down rate should not exceed 6C/Sec.

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