Resettable Ptc Products Page 63 Resettable PTC Products

POLY-FUSE Resettable PTCs 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/22/17 Surface Mount > 250S Series Soldering Parameters Time Temperature T P T L T S(max) T S(min) 25 t P t L t S time to peak temperature Preheat Ramp-up Ramp-down Ramp-do Critical Zone t L to t P Profile Feature Pb-Free Assembly Average Ramp-Up Rate (T S(max) to T P ) 3C/second max Pre Heat: Temperature Min (T s(min) ) 150C Temperature Max (T s(max) ) 200C Time (Min to Max) (t s ) 60 - 180 secs Time Maintained Above: Temperature (T L ) 217C Temperature (t L ) 60 - 150 seconds Peak / Classification Temperature (T P ) 260 +0/-5 C Time within 5C of actual peak Temperature (t p ) 20 - 40 seconds Ramp-down Rate 6C/second max Time 25C to peak Temperature (T P ) 8 minutes Max. -- All temperature refer to topside of the package, measured on the package body surface -- If reflow temperature exceeds the recommended profile, devices may not meet the performance requirements -- Recommended reflow methods: IR, vapor phase oven, hot air oven, N 2 environment for lead -- Recommended maximum paste thickness is 0.25mm (0.010inch) -- Devices can be cleaned using standard industry methods and solvents -- Devices can be reworked using the standard industry practices Environmental Specifications Operating/Storage Temperature -40C to +85C Maximum Device Surface Temperature in Tripped State 125C Passive Aging +85C, 1000 hours Humidity Aging +85C, 85%,R.H.,1000 hours Thermal Shock MIL-STD-202, Method 107 +125C to -55C 10 times Solvent Resistance MIL-STD-202, Method 215 Moisture Sensitivity Level Level 1, J-STD-020 Physical Specifications Terminal Material Solder-Plated Copper (Solder Material: Matte Tin(Sn)) Lead Solderability Meets EIA Specification RS186-9E, ANSI/ J-STD-002 Category 3.

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