Resettable Ptc Products Page 12 Resettable PTC Products

POLY-FUSE Resettable PTCs 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/22/17 Surface Mount > LoRho Series Temperature Rerating Curve -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 10% 30% 50% 70% 90% 110% 130% 150% 170% Temperature (C) Percentage of Rated Current Environmental Specifications Operating Temperature -40C to +85C Maximum Device Surface Temperature in Tripped State 125C Passive Aging +85C, 1000 hours -/+10% typical resistance change Humidity Aging +85C, 85% R.H.,100 hours -/+15% typical resistance change Thermal Shock MIL-STD-202, Method 107 +85C/-40C 20 times -30% typical resistance change Solvent Resistance MIL-STD-202, Method 215 No change Vibration MIL-STD-883, Method 2007, Condition A No change Moisture Sensitivity Level Level 1, J-STD-020 Physical Specifications Terminal Material Solder-Plated Copper (Solder Material: Matte Tin (Sn)) Lead Solderability Meets EIA Specification RS186-9E, ANSI/J-STD-002, Category 3. Soldering Parameters Time Temperature T P T L T S(max) T S(min) 25 t P t L t S time to peak temperature Preheat Ramp-up Ramp-down Ramp-do Critical Zone t L to t P Profile Feature Pb-Free Assembly Average Ramp-Up Rate (T S(max) to T P ) 3C/second max Pre Heat: Temperature Min (T s(min) ) 150C Temperature Max (T s(max) ) 200C Time (Min to Max) (t s ) 60 - 180 secs Time Maintained Above: Temperature (T L ) 217C Temperature (t L ) 60 - 150 seconds Peak / Classification Temperature (T P ) 260 +0/-5 C Time within 5C of actual peak Temperature (t p ) 20 - 40 seconds Ramp-down Rate 6C/second max Time 25C to peak Temperature (T P ) 8 minutes Max. -- All temperature refer to topside of the package, measured on the package body surface -- If reflow temperature exceeds the recommended profile, devices may not meet the performance requirements -- Recommended reflow methods: IR, vapor phase oven, hot air oven, N 2 environment for lead -- Recommended maximum paste thickness is 0.25mm (0.010 inch) -- Devices can be cleaned using standard industry methods and solvents -- Devices can be reworked using the standard industry practices Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.

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