Gas Discharge Tube Gdt Products Page 48 Gas Discharge Tube GDT Products

Gas Discharge Tubes 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/06/15 CG/CG2 Series Reflow Condition Pb - Free assembly Pre Heat - Temperature Min (T s(min) ) 150C - Temperature Max (T s(max) ) 200C - Time (Min to Max) (t s ) 60 - 180 secs Average ramp up rate (Liquidus Temp (T L ) to peak 3C/second max T S(max) to T L - Ramp-up Rate 5C/second max Reflow - Temperature (T L ) (Liquidus) 217C - Temperature (t L ) 60 - 150 seconds Peak Temperature (T P ) 260 +0/-5 C Time within 5C of actual peak Temperature (t p ) 10 - 30 seconds Ramp-down Rate 6C/second max Time 25C to peak Temperature (T P ) 8 minutes Max. Do not exceed 260C Soldering Parameters - Reflow Soldering (Surface Mount Devices) Time Temperature T P T L T S(max) T S(min) 25 t P t L t S time to peak temperature (t 25C to peak) Ramp-down Ramp-up Preheat Critical Zone T L to T P Soldering Parameters - Wave Soldering (Thru-Hole Devices) Soldering Parameters - Hand Soldering Dwell Time 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 210 220 230 240 Time (Seconds) Temperature (C) - Measured on bottom side of board Cooling Time Preheat Time Wave Parameter Lead-Free Recommendation Preheat: (Depends on Flux Activation Temperature) (Typical Industry Recommendation) Temperature Minimum: 100 C Temperature Maximum: 150 C Preheat Time: 60-180 seconds Solder Pot Temperature: 280 C Maximum Solder Dwell Time: 2-5 seconds Recommended Process Parameters: Solder Iron Temperature: 350 C +/- 5C Heating Time: 5 seconds max.

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